This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...

Samsung Electronics to Integrate 'Exynos' into Galaxy Z Flip 8Samsung Electronics' Mobile eXperience (MX) division is ...

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...

Samsung's next flip smartphone, the Galaxy Z Flip 8 is tipped to come powered by the newly launched Exynos 2600 processor.

Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on ...

Samsung is considering using the Exynos 2600 chip in the Galaxy Z Flip 8, aiming to boost AI performance, cut costs, and strengthen its semiconductor business. The post Samsung may power Galaxy Z Flip ...

Samsung appears ready to double down on its in-house chip strategy, with new reports suggesting that the Galaxy Z Flip 8 could once again ship exclusively with an Exynos processor when it launches in ...