Soaring silicon carbide (SiC) demand from electric vehicles (EV) is leading to a tight supply of 6-inch SiC wafers, of which the cost will unlikely go down. Abstract To raise SiC capacity while ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...

Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts processing time ...

Semiconductors are one of the most commonly utilized components in electronic circuits, providing high performance, reliability, and low cost. The production of semiconductor devices, which are ...

Despite silicon carbide’s (SiC) promise over conventional silicon for the design of next-generation power electronics devices, broad adoption of this high-performance compound semiconductor has been ...

FREMONT, CA / ACCESSWIRE / January 25, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced that a new ...

Prices may be falling, and competition is fierce, but the silicon wafer industry is still booming as China strives to build an independent supply chain for advanced semiconductors. Against this ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

BAY CITY, MI — Officials with the U.S. Department of Energy’s Loan Programs Office on Thursday, Feb. 22, announced a conditional commitment to Bay City’s SK Siltron CSS for a $544 million loan to ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...