DUBLIN, Nov. 6, 2019 /PRNewswire/ -- The "Global Semiconductor Silicon Wafer Market" report has been added to ResearchAndMarkets.com's offering. This report forecasts the market for compound ...
ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...
Dublin, Dec. 09, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Silicon Wafer Market" has been added to ResearchAndMarkets.com's offering. The global semiconductor silicon wafer market is poised for ...
"Driven by AI accelerators, automotive ECUs, and edge computing, the global semiconductor silicon wafer market sees rising ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Brewer Science, Inc., announces the release of its second generation of spin-on polymeric temporary wafer bonding materials with superior bonded pair thermal stability. The Brewer Science WaferBOND™ ...
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...
The two research institutes described the triple junction device’s features in a new paper. The cell relies on a top cell based on gallium indium phosphide (GaInP), a middle cell relying on gallium ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...
Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...
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