Engineers develop GaN semiconductors, liquid cooling systems and chiplet packaging to handle growing AI power demands in data ...
V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.
Overcoming the known power and size limitations in LiDAR design is critical to enabling scalable, cost-effective adoption ...
Mwale, L. and Nhlapo, B. (2026) High Voltage Direct Current (HVDC) Transmission Technology and DC Grids a Comprehensive ...
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