Abstract: Sn-Ag-Cu (SAC) alloys are a type of lead-free solder that are commonly used in microelectronic packaging. These materials typically contain more than 95% β-Sn, which is a highly anisotropic ...
Abstract: The crosstalk simulation analysis model complete transmission path is established by HFSS. Based on this model, the near end crosstalk S13 and far end crosstalk S14 of each frequency are ...
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