Ultraviolet-B (UV-B) semiconductor lasers are highly sought for medical, biotechnology, and precision manufacturing applications; however, previous UV-B laser diodes were limited to pulsed operation ...
Abstract: Three-dimensional stacked integration based on through-silicon via (TSV) meets the high-speed development requirements of integrated circuits (ICs). However, TSV is a sensitive unit prone to ...
Abstract: Aiming to achieve a compact receiver for wireless charging systems (WCSs), this letter proposes an integrated rectifier and rower adjustment (IRPA) circuit, featuring an ultra-simple ...
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