Abstract: The reliability assessment of ball grid array (BGA) components on system level for automotive applications requires a detailed simulation model, which describes the warpage behavior over ...
Abstract: The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packaging due to its feasibility in high density integrated circuits and convenience in the ...
Readme in German can be found here. ProSeed adds a bundle of functionality to enhance sowing machines in the game. With ProSeed you're able to create tramlines (with optional pre-emergence marking), ...
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