MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.
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New materials could boost the energy efficiency of microelectronics
MIT researchers developed a new fabrication method that could enable them to stack multiple active components, like transistors and memory units, on top of an existing circuit, which would improve the ...
Celebrated Chinese electronics engineer who ‘kept his homeland in his heart’ while living overseas buried in Fujian with his ...
Chronic stress can alter the brain’s fear and emotion systems, subtly influencing how we respond to everyday challenges and ...
With US curbs biting, experts say near-memory computing and chip stacking could narrow the AI hardware gap with Nvidia.
Most of us start to worry about our memory only when it begins to let us down: we walk into a room and can't remember why, we ...
The global semiconductor market is projected to grow closer to the one trillion mark, bringing global semiconductor revenue ...
Massachusetts Institute of Technology (MIT) researchers have unveiled a new materials and chip-fabrication approach that could dramatically ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
Vinci4D Inc., a provider of simulation software for chip designers, has secured $46 million in funding to enhance its technology. The startup raised the capital over two rounds that it announced on ...
Kioxia’s flash memory roadmap is shaping up for a busy two-year cycle, with BiCS9 set for mass production at the end of fiscal 2025 and the more advanced BiCS10 arriving in 2026.
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