V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.
Abstract: The LabPET II modular technology was identified as a promising platform for a new generation of Ultra-High Resolution (UHR) brain PET scanners. Scaling up from preclinical systems to achieve ...
Abstract: Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap [(U)WBG] materials. These materials, such ...
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