Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
I’ve had a fairly varied early part of my career in the semiconductors business: a series of events caused me to jump disciplines a little bit, and after one such event, I landed in the test ...
Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...
Over the past 10 years, the DRAM market has been one of the toughest commodity businesses in the electronics industry. Bit growth has averaged more than 60% per year, but at the same time, cycles of ...
Researchers at the National Institute of Standards and Technology (NIST) have devised a system for manipulating and precisely positioning individual nanowires Researchers at the National Institute of ...
After a slow start, a three-year-old technology being peddled by FormFactor Inc. to lower DRAM packaging costs may get a closer look now that semiconductor manufacturers are beginning the transition ...
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