Growth is fueled by strategic partnerships and a focus on large-diameter wafers, with notable demand from pureplay foundries and integrated device manufacturersDublin, Jan. 14, 2026 (GLOBE NEWSWIRE) - ...
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Yes, There Really Is A Difference Between Dicing And Chopping
If you've been toggling between dicing and chopping ingredients depending on your mood, that's a mistake. The different cutting methods can impact your dish.
Learn these tricks to make your kitchen experience better. (Photo: iStock) If you love cooking, you'll understand that the smallest details can make a big difference. The way you cut your ingredients ...
Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...
LONDON--(BUSINESS WIRE)--The global wafer dicing saws market size is poised to grow by USD 95.94 million during 2020-2024, progressing at a CAGR of almost 3% throughout the forecast period, according ...
All products featured on Bon Appétit are independently selected by Bon Appétit editors. However, when you buy something through our retail links, Condé Nast may earn an affiliate commission. A good ...
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TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
Dublin-based equipment maker Xsil today said it is ready to ship a fully automated laser-dicing tool for thin wafers that it says works without chipping or cracking. Once upon a time within the ...
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