It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...

ansys.aedt.core.Icepak.assign_source() can not correctly assign a surface heat flux in the model by giving the argument thermal_condition="Surface Heat" as instructed ...

Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...

ansys-aedt-toolkits-template @ file:///D:/Siva_Coding/pyaedt-icepak-model-reviewer ansys-pythonnet==3.1.0rc6 ansys-tools-visualization-interface==0.8.1 anyio==4.8.0 ...

PITTSBURGH, July 29, 2025 – Ansys (NASDAQ: SNPS) today announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 also ...

Increased edge processing, performance enhancements, and miniaturisation of embedded platforms have led to an increase in power consumption and heat generation, creating thermal hotspots. Thermal ...

(VOVWORLD) - The Rang Dong Light Source and Vacuum Flask Joint Stock Company, formerly the Rang Dong Light Source and Vacuum Flask Factory, has been a pioneer in the lighting industry in Vietnam for ...

NVIDIA Omniverse and Modulus enable Ansys to accelerate 3D simulation workflows, paving the way for next-generation semiconductor systems. In a groundbreaking development, NVIDIA Omniverse and Modulus ...

Ansys Access on Microsoft Azure enables seamless deployment of industry-leading simulation tools on a reliable, secure cloud platform infrastructure. Ansys Access on Microsoft Azure is available in ...

Ansys ANSS is leveraging NVIDIA Corporation’s NVDA Omniverse application programming interfaces (APIs). This will “supercharge” the design of 3D integrated circuits (3D-ICs) through the integration of ...