The rising demand for sustainable options to petroleum-based plastics has made biopolymer food packaging an exciting area for ...

With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...

Material firms Borouge and Borealis have introduced Recleo, a global brand for mechanically recycled polyolefins.

USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high-aspect ratio copper pillar mass-transfer technology, the company said. After three years ...

The growing global demand for safer, longer shelf life, and environmentally friendly food products has accelerated innovations in food packaging.

Established in 1961, Merrill’s has evolved into a specialist in custom thermoforming.

Engineering and Artificial Intelligence researchers from the University of Maryland teamed up to accelerate the search for ...

DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%.

Nelipak Corp buys Merrill's Packaging to expand custom thermoformed solutions for medical device and pharmaceutical ...

According to the latest report published by , global data center AI chip shipments are projected to grow from in 2024 to in 2030. This data center AI chip category includes high-end and mid-range GPUs ...

onsemi announced the release of its EliteSiC MOSFETs in the industry-standard T2PAK top-cool package, advancing power packaging for automotive and industrial applications.