The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...

Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...

Innodisk has launched its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI ...

Today James takes a look at the £220 Big Chungus V2 - the new version of the 'Fat Rabbit' case. Sadly, this chassis isn't without problems as James explains in some detail in our video today. 00:00 ...

Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series ...

Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...

All modules represent a significant advancement in edge AI computing. They offer up to 16 cores with up to 10 TOPS, feature an integrated NPU5 for low-power AI inference with up to 50 TOPS, and can ...

HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...

A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...

With the advent of Edge I/O technology, a seismic shift is underway, revolutionising the landscape of industrial automation ...

Thunderobot's new MIX GAMING 2 is a thin-and-tall Mini-PC with up to an Intel Core Ultra 9 275HX, up to NVIDIA GeForce RTX ...