The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Rebecca Oesterle saw the packaging industry growth first hand as one of Energizer’s earliest supply chain managers. Over her career, she led many changes in packaging—an industry that would become ...

The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...

Novel hybrid polymer “PET/F” expected to deliver enhanced performance compared with traditional PET plastic and have up to 100% bio content WEST SACRAMENTO, Calif. & BOLTON, Ontario--(BUSINESS ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

Four firms collaborate on foaming technology that incorporates recycled content while maintaining performance in multiple ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

The funding will upgrade processing and packaging technology, boosting halal-certified output and improving food safety and ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...