Precision Solutions for Semiconductors and Electronics The semiconductor industry represents the pinnacle of precision manufacturing. As components continue to shrink, the difficulty of inspection ...

OMRON Electronic Components, a global leader in innovative component solutions, today announced the launch of its P6K relay sockets, a surface-mount connecting socket designed specifically for the G6K ...

At this exhibition, we will present optimal automation solutions tailored to your production challenges in each process of the SMT production line, under the new concept of "PERFECT FIT AUTOMATION." ...

Improper paste viscosity and incorrect reflow ramp profiles are just a few of the root causes. Solder balls are small, spherical metallic balls that can form on circuit boards, typically around the ...

Getting the hang of through-hole soldering is tricky for those of us tinkering at home with our irons, spools, flux, and, sometimes, braids. It’s almost reassuring, then, to learn that through-hole ...

The “reverse hybrid” assembly process involves using SAC (Sn-Ag-Cu) solder paste in conjunction with BGA components that feature low-temperature solder (LTS) balls. The soldering is performed using a ...

Abstract: Electronics products are integrated part of our daily lives. Given examples of electronics components which will be assembled onto a Printed Circuit Board (PCB) for enabling of AI ...

In context: The Raspberry Pi Foundation's latest release, the Pi 500 Keyboard PC, integrates the powerful Raspberry Pi 5 into a sleek, compact keyboard design. The innovative form factor positions the ...

“We have achieved significant increases to our production capacity with the introduction of Siemens’ Process Preparation," said Stanly Rocky, assistant GM of Public Relations, Sat Nusapersada. Siemens ...