WESTFORD, Mass.--(BUSINESS WIRE)-- Materion Barr Precision Optics & Thin Film Coatings, a Materion Corporation (NYS: MTRN) business, announced today the current construction of a 3,000-square-foot ...
EV Group, a developer of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is partnering with DELO, amanufacturer of industrial adhesives, specified for ...
New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...
LONDON — A Morroco based start-up, Nemotek SA, has become the first to take a license on chip -packaging technology unveiled last June by Tessera Technologies Inc. that makes it possible to ...
3D optical profiling provides many benefits over other measurement methods used for non-contact inspection of semiconductor packaging front-end process research and control. These benefits range from ...
OptiML™ Wafer Level Camera (WLC) Technology Applies Microelectronics Techniques to Optics and is Designed to Enable Up to 30% Percent Cost Savings Long Term Tessera Technologies, Inc. (Nasdaq:TSRA), a ...
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